发明名称 Heat conducting adhesive joint between two workpieces used in the production of electronic components comprises a layer of heat conducting material having two flat sided surfaces with openings on each surface
摘要 Heat conducting adhesive joint between two workpieces (1, 2) comprises a layer (3) of heat conducting material having two flat sided surfaces (31) with openings on each surface defined by hollow chambers (32) in the layer. The joint is arranged between the workpieces so that one of the surfaces contacts one of the workpieces and the other surface contacts the other workpiece. The openings are filled with adhesive (4') to join the workpieces together. An independent claim is also included for a process for the production of a heat conducting adhesive joint between two workpieces. Preferred Features: The heat conducting material is made of silver. The heat conducting layer is made of sintered metal powder.
申请公布号 DE10009678(C1) 申请公布日期 2001.07.19
申请号 DE2000109678 申请日期 2000.02.29
申请人 SIEMENS AG 发明人 SCHWARZBAUER, HERBERT
分类号 C09J5/00;C09J201/00;H01L21/58;H01L23/36;H01L23/373;(IPC1-7):B32B7/04;B32B15/04;B32B3/10;B32B7/12;B32B5/18;B32B3/24 主分类号 C09J5/00
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