| 摘要 |
In a method for contacting a circuit chip containing an integrated circuit of a thickness less than 50 mum, which has at least two pads on a first main surface, the circuit chip is first of all placed onto a main surface of a support substrate with a second main surface which faces this first main surface, in such a way that the entire thickness of the circuit chip protrudes from the surface of the support substrate. A structured metallic coating is then applied to the first main surface of the circuit chip and the surface of the support substrate by means of screen printing or stamping, in order to connect the pads of the circuit chip to a conductor structure located on the main surface of the support substrate. Alternatively, the screen printing or stamping process is used to apply a structured metallic coating to the first main surface of the circuit chip and the surface of the support substrate, in order to produce a peripheral conductor structure, which is connected to the pads of the circuit chip, on the main surface of the support substrate and on the first main surface of the circuit chip. |
