发明名称 |
Multilayer wiring board |
摘要 |
A multilayer wiring board (50) including a core board which comprises a resin baseplate (10) outer wiring patterns (12) on one and the other sides of the core board (10), respectively, and throughholes (44) penetrating the core board and having a side wall coated with a conductive material (46) electrically connecting the outer wiring patterns with each other, wherein a space within the throughholes is filled with a filler material (48) having a thermal expansion coefficient substantially equal to that of the resin baseplate (10). <IMAGE> |
申请公布号 |
EP1035581(A3) |
申请公布日期 |
2001.07.18 |
申请号 |
EP20000301836 |
申请日期 |
2000.03.07 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO. LTD. |
发明人 |
OHI, MASAYUKI;IMAI, KUNIHIKO |
分类号 |
H01L21/48;H01L23/498;H01L23/538;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):H01L23/498;H05K1/02 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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