| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma process system free from local electric discharge and capable of uniform plasma process. SOLUTION: A chamber lid 1 disposed in the upper part of a chamber body 2 is provided with an opening 1a. A microwave introducing window 4 is inserted into the opening 1a, and an electric conductor layer 4a such as plating film is formed on the side of the microwave introducing window 4. |
