| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition system and a film deposition method capable of the easy delivery and holding of a substrate while the increase of the foot print is suppressed to a minimum. SOLUTION: A substrate WA with the face to be treated as the upper side is carried into a vacuum vessel 10 via a gate valve 70 and is mounted and fixed to the surface of a supporting board 51. A hearth liner 63a at the lower part of a hearth 61 is heated by a plasma beam PB, evaporation metal (film material) contained in the hearth liner 63a is melted and oozed out from the surface, and an evaporation beam of metal is stably emitted from the lower face US of the hearth liner 63a. This evaporation beam is ionized by the plasma beam PB and adheres on the surface of the substrate WA with the film deposition face as the upper side to deposit a film. At this time, since the stable vapor beam is emitted from the surface of the hearth liner 63a, the metal can easily be buried in the surface of the substrate WA, so that the deposition of the wiring film is made easy.
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