| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition excellent enough in dimensional stability to be almost free from a dimensional change caused by temperature changes and exhibiting electroconductivity and to provide a container composed of the same for an electronic part. SOLUTION: The resin composition comprises 100 pts.wt. of the total of an aromatic vinyl compound-based polymer (A) and/or a polyphenylene ether- based polymer (B), and incorporated thereinto, a non-electroconductive inorganic filler material (C), a fibrous electroconductive filler material (D) and a non- fibrous electroconductive filler material (E), each within a specific range. The container for an electronic part is excellent enough in dimensional stability to be almost free from a dimensional change caused by temperature changes and exhibits electroconductivity, and therefore is capable of protecting electronic parts such as IC chips and the like from electrostatic breakdown.
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