| 摘要 |
PROBLEM TO BE SOLVED: To provide a tray with high efficiency for storage of taper carrier packaged(TCP) type semiconductor devices wherein an electrical characteristics test can be performed without damaging leads. SOLUTION: The tray serves as a tray for receiving a tape carrier package type semiconductor device including an insulating tape having a conductive lead pattern on a surface and also having a plurality of guide holes, a semiconductor chip fixed to the tape, a means for electrically connecting a predetermined lead provided on the tape with a predetermined electrode of the semiconductor chip and an insulating resin body covering a part including the semiconductor chip, and it also serves as a tray for testing electrical characteristics. The tray has a plurality of guide pins which are inserted into at least some of the guide holes respectively whereby the semiconductor device can be fixed to the tray and a support section for supporting a part of the tape which supports close a part of the lead with which a measurement terminal for testing the electrical characteristics is brought into contact. |
