发明名称 Double gate-oxide for reducing gate-drain capacitance in trenched DMOS with high-dopant concentration buried-region under trenched gate
摘要 This invention discloses a DMOS power device supported on a substrate. The DOS power device includes a drain of a first conductivity type disposed at a bottom surface of the substrate. The DMOS power device further includes a gate disposed in a trench opened from a top surface of the substrate, the gate having a polysilicon layer filling the trenches padded by a double gate-oxide structure. The double gate-oxide structure includes a thick-oxide-layer covering walls of the trench below an upper portion of the trench and a thin-gate-oxide covering walls of the upper portion of the trench thus defining a champagne-glass shaped gate in the trench. The DMOS power device further includes a source region of the first conductivity type disposed in the substrate surrounding a top portion of the trench. The DMOS power device further includes a body region of a second conductivity type disposed in the substrate surrounding the trench and encompassing the source region.
申请公布号 US6262453(B1) 申请公布日期 2001.07.17
申请号 US19980066033 申请日期 1998.04.24
申请人 MAGEPOWER SEMICONDUCTOR CORP. 发明人 HSHIEH FWU-IUAN
分类号 H01L21/336;H01L29/08;H01L29/10;H01L29/423;H01L29/78;(IPC1-7):H01L29/76 主分类号 H01L21/336
代理机构 代理人
主权项
地址