HEAT-RESISTANT BONDING SHEET AND COPPER CLAD LAMINATED SHEET COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heat-resistant bonding sheet having sufficient mechanical strength and excellent in solder heat resistance, adhesiveness, dimensional stability and low dielectric characteristics and a copper clad laminated sheet using this bonding sheet. SOLUTION: In a heat-resistant bonding sheet obtained by coating at least the single surface of a base film comprising a heat-resistant resin with a polyamic acid being a precursor of a thermoplastic polyimide resin and subsequently adjusting the imidation ratio of the polyamic acid to 10-90%, the high adhesiveness of the base film and the thermoplastic polyimide interface can be especially realized. This bonding sheet is also excellent in heat resistance and solder heat resistance and can be especially used for a flexible copper clad laminated sheet.