发明名称 Substrate process method and substrate process apparatus
摘要 Just after resist solution is coated on a substrate, it is dried substantially in a non-heating state. In reality, inertia gas or the like is blown from a shower head to the substrate. Thus, the resist solution coated on the substrate is dried. Consequently, transfer marks that cause the film thickness of resist film to be unequal and the line width of a circuit pattern to fluctuate can be prevented.
申请公布号 US6261007(B1) 申请公布日期 2001.07.17
申请号 US19990362860 申请日期 1999.07.29
申请人 TOKYO ELECTRON LIMITED 发明人 TAKAMORI HIDEYUKI;TATEYAMA KIYOHISA;MIZOSAKI KENGO;ANAI NORIYUKI;SAKAI MITSUHIRO;TANAKA SHINOBU;HONDA YOICHI;SHIMOMURA YUJI
分类号 G02F1/1333;G03F7/16;H01L21/00;(IPC1-7):G03D5/00 主分类号 G02F1/1333
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