| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which enables an adhesive strength almost the same as that of a thioamide compound to be obtained. SOLUTION: This resin composition contains (1) a polymerizable monomer, (2) a curing agent, and (3) a reducing agent having a structure represented by formula A and/or formula B (wherein R1, R2 and R3 are each H, phenyl, benzoyl, acetyl, or a 1-6C alkyl; R4 is H, phenyl, benzoyl, acetyl, or a 1-6C alkyl; and R5 is a 1-6C alkylene). The composition may further contain (4) an elastomer component.
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