发明名称 SOLID ADHESIVE MELTING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid adhesive melting device capable of easily and rapidly melting a solid adhesive. SOLUTION: Pipes 7 are horizontally attached to the vicinity of the bottom of the device body 1 to be crossed and a cartridge heater 8 is inserted into each pipe 7. Many heating bodies each having an upper part formed into dentate shape are provided at a certain interval above the pipes 7. The solid adhesive 14 is charged into the device body 1 and a weight 15 is placed. The cartridge heater 8 is energized to heat. The temp, of the heating body 9 is attained to a high temperature to melt the solid adhesive 14. The dentate part of the heating body 14 bites to stick into the lower part of the molten solid adhesive 14. The melting proceeds further by increasing the contact area with the heating body 9 with the progress of the biting. A synergistic effect between the progress of the melting and the increase in the contact area is produced.
申请公布号 JP2001191007(A) 申请公布日期 2001.07.17
申请号 JP20000037215 申请日期 2000.01.12
申请人 NIKOO GIKEN:KK 发明人 HASHI MITSUHARU
分类号 B05C5/04;C09J5/06;(IPC1-7):B05C5/04 主分类号 B05C5/04
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