发明名称 PERCUTANEOUS TREATMENT TOOL
摘要 PROBLEM TO BE SOLVED: To provide a percutaneous treatment tool using a semiconductor layer which is stuck to the whole or partial surface of a sheet which is composed of cloth, etc., and becomes the base of the tool, put on the affected part of a patient at the time of treating the patient, does not crack nor fall down from the sheet when the affected part is the knee or elbow making bending and stretching motions and the tool is extended and contracted in accordance with the bending and stretching motions, and is stuck to the sheet 3 with an improved sticking means. SOLUTION: The expandable-contractible percutaneous treatment tool is constituted in such a way that the semiconductor layer 1 which is formed by mixing a powdery semiconductor in an expandable/contractible base material is stuck to the surface of the sheet 3 with an expandable/contractible adhesive layer 2 or by printing the semiconductor layer 1 on the adhesive layer 2. In addition, a finger-pressure effect can be added to the tool by protruding the semiconductor section from the surface of the tool which comes into contact with human bodies as a supporter. Moreover, thermal transfer or water transfer is used as a means for sticking the semiconductor layer 1 to the sheet 3.
申请公布号 JP2001190690(A) 申请公布日期 2001.07.17
申请号 JP20000111375 申请日期 2000.03.09
申请人 KENTOSU:KK 发明人 EBIHARA TOSHIYOSHI
分类号 A61N1/00;(IPC1-7):A61N1/00 主分类号 A61N1/00
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