发明名称 PALLADIUM PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a palladium plating solution which makes it possible obtain a stable palladium deposit of high purity which has excellent mirror finished surface gloss and does not give rise to cracks of >=5 μm of a plating film. SOLUTION: This palladium plating liquid contains 0.1 to 40.0 g/l soluble palladium salt as the amount of palladium, 0.01 to 10 g/l pyridine carboxylic acid and/or 0.02 to 1.0 g/l at least one kind selected from soluble iron salt, zinc salt, thallium salt, selenium salt, tellurium salt, etc., as the amount of metals, 0.005 to 10 g/l amine-base derivative of the pyridine carboxylic acid and 0.001 to 1.2 g/l aldehyde benzoic acid-base derivative and anionic surfactant or amphoteric surfactant.
申请公布号 JP2001192885(A) 申请公布日期 2001.07.17
申请号 JP20000211927 申请日期 2000.06.09
申请人 KOJIMA KAGAKU YAKUHIN KK 发明人 AKIMOTO TAKEMI;ARAI YOTARO
分类号 C25D3/50;C25D3/52;C25D3/56 主分类号 C25D3/50
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