Method for fitting a semiconductor chip

摘要

The essence of the method resides in that a recess (2) is made in the mounting surface, having the dimensions exceeding those of a chip (3). The chip (3) is gripped with a gripping member appearing as a tool (4) having a flat end and a capillary hole (5) flaring up towards the tool end, and is oriented above the recess (2). Before pressing the chip (3) into the recess (2) a dosed amount of a binder (6) is placed therein. The chip (3) is pressed into the binder (6) until the part of the flat end of the tool (4) which extends beyond the outlines of the chip (3) thrusts against the mounting surface. The pressing-in procedure is stopped as soon as the face surface of the chip (3) is coincided with the surface on which the recess (2) is made, whereupon the gripping tool is disengaged.