| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface polishing device capable of highly smoothly flattening a semiconductor wafer. SOLUTION: A surface polishing device is constituted of a disc type polishing tool 11 to be rotationally driven, a pressure means 21 to make a workpiece 12 pressure contact with a working surface of the polishing tool 11, a polishing liquid supply mschanism 13 arranged at a backward position of the workpiece 12 and to supply polishing liquid to the working surface, a dresser 23 arranged at a frontward position of the workpiece 12 in the rotating direction of the polishing tool 11 and to set a saw on the working surface and a polishing liquid suction mechanism 14 arranged between the dresser 23 and the polishing liquid supply mechanism 13 and to suck and collect polishing liquid on the working surface. |
