发明名称 |
Method for performing chemical-mechanical polishing |
摘要 |
An apparatus and method for performing chemical-mechanical polishing is disclosed in which the pad is secured to the platen without the use of adhesives. A polishing pad and a platen are secured together by a releasable attractive force; the force may comprise a vacuum or electromagnetic force, and the pad has a hard or magnetic backside layer for facing the plating and responding to the attractive force. This invention has particular application to chemical-mechanical polishing for use in planarizing dielectrics.
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申请公布号 |
US6261958(B1) |
申请公布日期 |
2001.07.17 |
申请号 |
US19990450485 |
申请日期 |
1999.11.29 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
CREVASSE ANNETTE MARGARET;MAURY ALVARO;PATEL SANJAY;SOWELL JOHN THOMAS |
分类号 |
B24B37/04;B24B45/00;(IPC1-7):H01L21/302 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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