SUBSTRATE TREATMENT APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus which uniformize the flow of the treatment solution and allows the uniform treatment on substrates on the bottom surface of a treatment tank. SOLUTION: An overflow unit to allow the plating solution 37 to overflow from a whole periphery of an upper portion of a side surface is provided on the side surface of the treatment tank 31, a slit 47 is provided in a lower portion of the side surface of the treatment tank 31, and the plating solution 37 is discharged from the whole periphery of the side surface in the vicinity of a semi-conductor wafer 33 via the slit 47.