发明名称 HEAT INSULATOR BOARD AND HEAT INSULATING AND AIRTIGHT STRUCTURE USING IT
摘要 PROBLEM TO BE SOLVED: To solve problems of the deterioration of an airtight performance resulting from the peeling off of an airtight tape 3 due to secular change because the pressing against the airtight tape 3 is not considered in an externally heat insulating structure of an insulator board not laminated, for example, in a document 2. SOLUTION: In a foaming plastic insulator board having a shiplap structure on at least a set of sides opposed to each other, a foaming plastic insulator board having an airtight tape stuck on the vertical contact surface of at least one shiplap part is installed on the outdoor side of a wooden framework structure formed of columns, beams, and sills so that the sides having the shiplap parts become horizontal so as to form a heat insulating airtight structure. Thus, the airtight tape is sandwiched and pressed tightly by the shiplap parts.
申请公布号 JP2001193185(A) 申请公布日期 2001.07.17
申请号 JP20000004913 申请日期 2000.01.13
申请人 KANEGAFUCHI CHEM IND CO LTD 发明人 TAKAHASHI SHIGENOBU;ISHII MASAO;MATSUNARI YASUNORI
分类号 E04B1/80;E04B1/76;(IPC1-7):E04B1/80 主分类号 E04B1/80
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