| 摘要 |
PROBLEM TO BE SOLVED: To attain a sputtering system capable of depositing, with superior coating on a portion different in height, a film composed of a metal or its compound on a contact hole of high aspect ratio. SOLUTION: An ion reflecting plate 5 capable of reflecting ions composed of target material is provided along the side wall of a sputter chamber 2, and a grounded lower ground parts 6 are provided under the plate, and further, a mechanism for applying negative voltage to a substrate 1 is provided.
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