发明名称 |
Microwave transmitter/receiver module |
摘要 |
A microwave transmitter/receiver module has a package that includes a high-frequency circuit board and an electromagnetically narrowed space. A semiconductor chip is mounted on the circuit board and is contained in the electromagnetically narrowed space. The electromagnetically narrowed space has a cutoff frequency that is higher than a carrier frequency for microwave communication. A receiver antenna pattern is formed on the top surface of the package and is electromagnetically connected to the semiconductor chip through a first slot. A transmitter antenna pattern is formed on the top surface of the package at a different position from the receiver antenna pattern and is electromagnetically connected to the semiconductor chip through a second slot. Since the antenna patterns are on the top surface of the package, the proper performance thereof is secured and the package is compact.
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申请公布号 |
US6263193(B1) |
申请公布日期 |
2001.07.17 |
申请号 |
US19980044911 |
申请日期 |
1998.03.20 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
ISEKI YUJI;YAMAGUCHI KEIICHI;KONNO MITSUO |
分类号 |
H01L23/552;H01Q13/18;H01Q21/00;H01Q23/00;H04B1/38;(IPC1-7):H04B1/38 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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