发明名称 STENCIL PLATE MAKING UP DEVICE
摘要 PROBLEM TO BE SOLVED: To completely dissipate heat conducted to a conveyance system during thermally perforating a stencil and carry out the proper conveyance of the stencil. SOLUTION: In the printing plate making up device which thermally perforates the stencil (a stencil assembly l) held between a thermal head 22 and a conveying roller 17 arranged opposite to the thermal head 22 during the conveyance of the stencil by the roller 17, a sheetlike element 36 (a highly heat conductive member) which comes into contact with the conveying roller 17 is installed. When the stencil is made up, the temperature rise (temperature change) of the conveying roller 17 by the heat of the thermal head 22 is inhibited so that the diameter of the conveying roller 17 of a rubber material remains unchanged. Thus the fluctuations of a conveying velocity of the stencil by the conveying roller 17 are eliminated and thereby the precision of a position for making up the stencil is upgraded.
申请公布号 JP2001191477(A) 申请公布日期 2001.07.17
申请号 JP20000002690 申请日期 2000.01.11
申请人 RISO KAGAKU CORP 发明人 KODAMA KENGO
分类号 B41L13/02;B41C1/055;(IPC1-7):B41C1/055 主分类号 B41L13/02
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