发明名称 |
Semiconductor component and method for manufacturing the semiconductor component |
摘要 |
A method for packaging a semiconductor device (23) to form a semiconductor component (10). A die attach material (17) is disposed on a flange (11). A semiconductor chip (23) is bonded to the die attach material (17). After disposing the die attach material (17) on the flange (11), an insulator material (28) is coupled to the flange (11). A leadframe (32) is coupled to the semiconductor chip (23) via a plurality of wirebonds (36). The wirebonds (36) and the semiconductor chip (23) are protected by a lid (37).
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申请公布号 |
US6261868(B1) |
申请公布日期 |
2001.07.17 |
申请号 |
US19990285827 |
申请日期 |
1999.04.02 |
申请人 |
MOTOROLA, INC. |
发明人 |
MILLER GERALD R.;VISWANATHAN LAKSHMINARAYAN |
分类号 |
H01L23/66;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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