| 摘要 |
A semiconductor memory device is provided with an MPU, a secondary cache and a TAG memory mounted on a chip. Registers are provided for a plurality of test data buses connected parallel to a plurality of data buses from the MPU to the secondary cache or the TAG memory. The registers and the plurality of data buses of the MPU are changed with switches so as to be connected with a bonding pad which is a part of an external terminal for the MPU. With this arrangement, the semiconductor memory device can connect with a tester for a DRAM part test via the bonding pad. |
