| 摘要 |
PURPOSE: To prevent the generation of an organic gas or the like by coating the chip mounting part of a substrate with an anaerobic adhesive and pressing a chip against the adhesive. CONSTITUTION: The chip mounting part is coated with an anaerobic adhesive. The main agent contains one kind or more of methacrylates, e.g. polyether, polyester, epoxy and urethane, by 20-40wt.%. At least one kind of peroxides or peroxycarbonates, e.g. hydrogen peroxide, hydroxy compounds, dialkyl compounds, diacyl compounds ketones and alkyl compounds, is added by 0.1-2wt.% as a hardener. 60-80wt.% of silver, gold, Pd, platinum, copper and Ni is added as a filter. When a chip 6 is pressed against an anaerobic adhesive 5, the adhesive 5 is spread thinly between the bottom face of the chip 6 and the chip mounting part 2 thus bonding the chip 6 to the chip mounting part. Since high temperature heating is not required, contamination by organic gas, inevitable in conventional die bonding process, can be prevented.
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