PRESSURE TRAY FOR MANUFACTURING SEMICONDUCTOR PROTECTION PACKAGE

摘要

PURPOSE: A pressure tray for manufacturing a semiconductor protection package is provided to improve the productivity by preventing an inferior protection package from a gas of an adhesive. CONSTITUTION: A housing(4) of a protection package and a glass lead(6) are inserted into an insertion portion(8,10). A multitude of base(12) of a plate shape is formed on an upper face of the insertion portion(8,10). A pressure plate(14) is formed on an upper face of the base(12) in order to press the housing(4) and the glass lead(6) to each other. A fixing portion(16) fixes the base(12) and the pressure plate(14) to each other. An elastic member(18) is formed on a bottom face of the pressure plate(14).