EDGE RING FOR RAPID THERMAL PROCESS

摘要

PURPOSE: An edge ring for rapid thermal process is provided to maintain uniformly a temperature of a wafer by minimizing a contact area between the wafer and an edge ring. CONSTITUTION: An edge ring(100) has a ring(110) and a plurality of pin(200) for loading a wafer. The edge ring(100) and the pin(200) are formed with Si or Sic. A bore of the edge ring(100) is less than an outside diameter of the wafer. An outside diameter of the edge ring(100) is more than the outside diameter of the wafer. The pin(200) has a geometrical figure such as a circular cone, a triangular pyramid, a hexahedron, and a triangular prism. A height of the pin(200) is 0.3mm to 1mm.