APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PROTECTION PACKAGE

摘要

PURPOSE: An apparatus and a method for manufacturing a semiconductor protection package are provided to improve the productivity by preventing a gas generated from an adhesive. CONSTITUTION: A semiconductor is loaded on a housing of a box shape. A glass lead is adhered on an upper face of the housing. A housing supply portion(10,12) supplies the housing. A preheating portion(14) preheats the supplied housing. A glass lead supply portion(16,18) supplies the glass lead applied with an adhesive on the upper face of the housing. An oven(20) heats the glass lead and the housing. An air curtain(48) is formed between the preheating portion(14) and the oven(20). A fixing tray(24,26) presses the housing and the glass lead.