| 摘要 |
<p>PURPOSE: An electronic component device is provided to reduce outside size,to improve reliability by an improvement in hermeticity and to improve productivity by a reduction in manufacturing process. CONSTITUTION: The electronic component device includes a resin base(1) integrally formed with a lead member (lead frame, 3) by free molding, at least one chip(2) made of a piezoelectric substrate and mounted on the resin base(1) and electrically directly or indirectly connected to an inner lead member (bonding pad, 3c) exposed to the resin base(1) by a bonding wire(4), and a resin cap(5) for protecting the chip(2) with a hollow region therebetween, wherein the resin cap(5) is bonded to the resin base(1) in order to form space between the resin cap(5) and the resin base(1).</p> |
