发明名称 Akustische Oberflächenwellenanordnungen
摘要 The invention is intended to present a surface acoustic wave device capable of preventing spreading of insulating resin and reducing in size. The constitution comprises a multi-layer substrate possessing input and output electrodes and grounding electrode on the mounting surface side of a dielectric layer, and possessing an outer electrode on the other surface of said electric layer, with said input and output electrodes and grounding electrode connected electrically with the outer electrode respectively, a surface acoustic wave element mounting a principal surface forming an electrode pad and comb-shaped electrode by face-down method, a metal bump applying a conductive resin on said electrode pad, and an insulating resin formed on the periphery of the metal bump, wherein said input and output electrodes, grounding electrode and surface acoustic wave element are electrically connected through the metal bump respectively, and a guard layer shorter in height than the surface acoustic wave element is formed outside of the surface acoustic wave element, on the mounting surface side of said multi-layer substrate. <IMAGE>
申请公布号 DE69613170(D1) 申请公布日期 2001.07.12
申请号 DE1996613170 申请日期 1996.03.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TSUJI, YASUNOBU;TAGUCHI, YUTAKA;ONISHI, KEIJI;EDA, KAZUO;MIYAUCHI, KATSUYUKI
分类号 H03H9/145;H03H9/02;H03H9/05;H03H9/25 主分类号 H03H9/145
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