发明名称 |
PRODUCING METHOD OF METAL WIRES |
摘要 |
PURPOSE: A producing method of a metal wire is provided to manufacture a metal wire at a low cost and to be easily applicable to a large-sized substrate without using a vacuum film-forming device. CONSTITUTION: A photosensitive underlying resin film(2) is formed on an insulating substrate(1) by a coating method. Exposure and development onto the underlying resin film are performed to obtain an underlying resin film(2a) patterned into a wiring form. A low-resistance metal(3) of Cu is subjected to film formation on the patterned underlying resin film with non-electro-selective plating. The metal wire is produced at a low cost without using a vacuum underlying method.
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申请公布号 |
KR20010067098(A) |
申请公布日期 |
2001.07.12 |
申请号 |
KR20000048911 |
申请日期 |
2000.08.23 |
申请人 |
SHARP CORPORATION |
发明人 |
CHIKAMA YOSHIMASA;IZUMI YOSHIHIRO |
分类号 |
G02F1/136;C23C2/02;C23C18/31;C25D1/04;C25D5/02;C25D5/54;G02F1/1368;H01B13/00;H01L21/288;H01L21/3205;H01L23/52;H01L29/786;H05K3/18;H05K3/24;(IPC1-7):G02F1/136 |
主分类号 |
G02F1/136 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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