发明名称 WAFER BOAT AND HEAT TREATMENT APPARATUS WITH WAFER BOAT
摘要 PURPOSE: To provide a low-cost wafer boat and a heat treatment apparatus with the wafer boat for enabling reduction of errors in assembling and use a conventional tool, even for the wafers with larger diameters. CONSTITUTION: Since a wafer holding part 5 is made removable from a boat support 3 when the wafer holding part 5 is mounted on the boat support 3, the wafer boat is separated into the wafer holding part 5 with the needs for less accuracy and a wafer boat main body requiring relatively no accuracy. As a result, the assembling step of the wafer boat can be simplified. Even for the wafers with large diameter, the wafer boat can be assembled using existing production equipment and technology. The wafer board can be manufactured at a low cost, by omitting the cost of new equipment or the development as a manufacturing cost of the wafer boat.
申请公布号 KR20010067190(A) 申请公布日期 2001.07.12
申请号 KR20000054762 申请日期 2000.09.19
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. 发明人 MINAMI MASASHI
分类号 H01L21/22;H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/22
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