发明名称 HIGH DIELECTRIC CONSTANT MATERIAL DEPOSITION TO ACHIEVE HIGH CAPACITANCE
摘要 A method for forming a dielectric layer includes exposing a surface to a first dielectric material in gaseous form at a first temperature (Step 100). Nuclei of the first dielectric material are formed on the surface (Step 104). A layer of a second dielectric material is deposited on the surface (Step 108) by employing the nuclei as seeds for layer growth wherein the depositing is performed at a second temperature which is greater than the first temperature.
申请公布号 WO0150509(A1) 申请公布日期 2001.07.12
申请号 WO2001US00184 申请日期 2001.01.04
申请人 INFINEON TECHNOLOGIES NORTH AMERICA CORP.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 SHEN, HUA;LAIBOWITZ, ROBERT;SAENGER, KATHERINE, LYNN;KOTECKI, DAVID;ATHAVALE, SATISH, D.;LIAN, JENNY;GUTSCHE, MARIN;YU-WANG, YUN;SHAW, THOMAS
分类号 H01L21/02;H01L21/314;H01L21/316;(IPC1-7):H01L21/316 主分类号 H01L21/02
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