发明名称 SOLDER PASTE INSPECTION SYSTEM
摘要 A novel inspection system (10) for inspecting an article of manufacture, such as a printed circuit board (22), is disclosed, where the system (16) includes a strobed illuminator (38) adapted to project light through a reticle (41) so as to project a pattern of light onto an area of the printed circuit board. A board transport (16) responsively positions the board (22) to at least two distinct positions, where each position corresponding to a different phase of the projected light. Also included is a detector (18) adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. An encoder (24) monitors the movement of the board (22) and outputs a position output (20), and a processor (14) connected to the encoder (24), the board transport (16), the illuminator (38) and the detector (18) controlledly energizes the illuminator (18) to expose the area as a function of the position output (20), the processor (14) co-siting the at least two images and constructing a height map image (4) with the co-sited images.
申请公布号 WO0150760(A1) 申请公布日期 2001.07.12
申请号 WO2000US42760 申请日期 2000.12.12
申请人 CYBEROPTICS CORPORATION 发明人 FISHBAINE, DAVID;SKUNES, TIMOTHY, A.;RUDD, ERIC, P.;KRANZ, DAVID, M.;HAUGAN, CARL, E.
分类号 G01B11/02;G01B11/25;G01B11/30;G01N21/956;G06T7/00;H04N7/18;H05K3/34;(IPC1-7):H04N7/18;G06K9/00 主分类号 G01B11/02
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