发明名称 METHOD AND APPARATUS FOR CONDITIONING A POLISHING PAD
摘要 <p>A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller (202) having an abrasive substance affixed to it against a moving polishing pad (46). The roller may be actively rotated or reciprocated at variable rates, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.</p>
申请公布号 WO2001049453(A1) 申请公布日期 2001.07.12
申请号 US2000035457 申请日期 2000.12.28
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