发明名称 |
SEMICONDUCTOR AND ITS FABRICATING METHOD |
摘要 |
PURPOSE: A semiconductor and its fabricating method are provided to fabricate of both compact memory and high performance logic on the same semiconductor chip. CONSTITUTION: An unreacted cobalt or titanium(66) covering the horizontal surfaces of the nitride logic spacer(62) is removed by a wet etching process. Then a barrier nitride layer(72) is deposited over the entire surface of chip(9), followed by a dielectric(73) such as a layer of flowable doped glass, for example Boro-Phospho Silicate Glass(BPSG) or fluorinated BPSG(F-BPSG), which is then densified. Dielectric(73) may be polished level with memory gate stack(42), or may extend above the stack(42) by several thousand Angstroms.
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申请公布号 |
KR20010067355(A) |
申请公布日期 |
2001.07.12 |
申请号 |
KR20000063259 |
申请日期 |
2000.10.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION. |
发明人 |
AGNELLO PAUL D.;CHEN BOMY A.;CROWDER SCOTT W.;DIVAKARUNI RAMACHANDRA;IYER SURBRAMANIAN S;SINITSKY DENNIS |
分类号 |
H01L21/8234;H01L21/8242;(IPC1-7):H01L21/824 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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