WIRED ELECTRONIC PARTS

摘要

PURPOSE: To obtain wired electronic parts which can prevent thinning and fusion of its wires by suppressing the Cu melting from a wire to solder as much as possible. CONSTITUTION: A chip coil has electrodes 13 each of which is composed of a base metallic (Ag) layer 13a, a plated Ni layer 13b, and a plated Sn-Cu layer 13c at both ends of a core 10. The terminals 16 and 16 of a wire 15 are buried in the plated Sn-Cu layer 13c by thermocompression bonding. When the chip coil is subjected to reflow soldering, the Cu of the plated Sn-Cu layer 13c malts into reflow solder and suppresses the Cu from melting out of the wire 15.