BONDING DEVICE AND BONDING METHOD

摘要

PURPOSE: To reduce the number of cameras for offset calibration, in the case where a projected reference member is used for the correction of the offset of a bonding device. CONSTITUTION: An axial center 4a of a tool 4 is made to approach a reference member 30, light-emitting diodes 16 and 17 are lighted up in the order, to photograph images in the XY directions of the member 30 and the tool 4 by a offset calibration camera 12 and the amount of the deviation of the tool 4 from the member 30 is measured by the camera 12. A camera 7 for position detection is made to approach the member 30 to measure the amount of the deviation of the optical axis 7a of the camera 7 from the member 30 by the camera 7. Accurate amount of the offset of a bonding device is found, on the basis of the measured values of these amounts of the deviation and the distances of movement of the tool 4 and the camera 7.