| 摘要 |
The present invention provides an improved end-effector which reduces back surface contamination (the "fingerprint") on wafer surfaces during the handling of the wafer during wafer manufacturing, more particularly, CMP/cleaning processes. The end-effector has with a vacuum pocket with various footprint sizes, shapes and configurations with an area of about 231-451 mm<2>. The area surrounding the vacuum pocket (or pockets) may be raised so that the wafer contacts the end-effector only in proximity to the vacuum pocket. The end-effector may further be coated with a friction reducing coating that helps to generate low particulate generation and generates less wear on silicon wafer surfaces. |
