| 摘要 |
<p>A high density, non-bussed semiconductor package and a full body gold (FBG) method for manufacturing semiconductor packages are provided to improve electrical and mechanical connections with semiconductors and other electronic components and devices. The semiconductor package is fabricated by developing circuitry on the wire bond side of the semiconductor package prior to developing the ball attach side. The copper circuitry on the wire bond side is fully covered and protected from the environment. Solder masks are applied directly to the semiconductor substrat or copper layer to avoid contact with gold. The ball attach area is covered and protected by metallic layers, such as nickel and gold, or an organic solderable material to eliminate weak solder mask-gold connections.</p> |
