| 发明名称 |
Semiconductor device and manufacturing method thereof |
| 摘要 |
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.
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| 申请公布号 |
US2001007781(A1) |
申请公布日期 |
2001.07.12 |
| 申请号 |
US20010771985 |
申请日期 |
2001.01.30 |
| 申请人 |
MIYAZAKI CHUICHI;AKIYAMA YUKIHARU;SHIBAMOTO MASANORI;KUDAISHI TOMOAKI;ANJOH ICHIRO;NISHI KUNIHIKO;NISHIMURA ASAO;TANAKA HIDEKI;KIMOTO RYOSUKE;TSUBOSAKI KUNIHIRO;HASEBE AKIO |
发明人 |
MIYAZAKI CHUICHI;AKIYAMA YUKIHARU;SHIBAMOTO MASANORI;KUDAISHI TOMOAKI;ANJOH ICHIRO;NISHI KUNIHIKO;NISHIMURA ASAO;TANAKA HIDEKI;KIMOTO RYOSUKE;TSUBOSAKI KUNIHIRO;HASEBE AKIO |
| 分类号 |
H01L21/60;H01L21/50;H01L21/98;H01L23/12;H01L23/28;H01L23/48;H01L23/495;H01L23/498;H01L23/50;H01L27/105;(IPC1-7):H01L23/34;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
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