发明名称 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
摘要 <p>The invention concerns a method involving the following steps: performing a first engraving on a first face of a plate made of an electroconductive material to form reliefs and grooves corresponding to the future tracks and the space between said tracks; subjecting said first face to a black oxide treatment (40); applying a layer made of an adhesive material on said first previously engraved, black oxide treated face; injection molding a dielectric material (20) on said first previously engraved and treated face fitted with an applied adhesive layer to cover said reliefs and grooves; performing a second selective engraving on a second face opposite said first face of the aforementioned plate to eliminate the material from the plate in the areas corresponding to said future tracks and spaces between the tracks so that finished tracks (16) which are insulated from one another and are partially imbedded on one face of said dielectric material (20) and separated by the space between the tracks (18) remain.</p>
申请公布号 WO2001050824(A1) 申请公布日期 2001.07.12
申请号 ES1999000413 申请日期 1999.12.31
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