发明名称 MICROPHONE ASSEMBLY WITH JFET FLIP-CHIP BUFFER FOR HEARING AID
摘要 <p>A hearing aid microphone module housing all the electronic components needed for a functional hearing aid other than the battery and receiver is described which uses flip-chip technology to couple a JFET buffer to the components. The buffer is disposed on a PCB which defines a back volume of the housing.</p>
申请公布号 WO2001050814(A1) 申请公布日期 2001.07.12
申请号 US2000000252 申请日期 2000.01.06
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