| 摘要 |
PURPOSE: A blind system for a manufacturing process of a semiconductor device is provided to eliminate a particle source caused by defocus, by excluding an unnecessary chip in an outermost shot of a wafer when an exposure process is performed by using the blind system. CONSTITUTION: N chips(N is a positive integer) on a wafer are formed as one shot, and a main blind makes a pattern projected through a lens exposed to the N chips. A main motor(X1,Y1,X2,Y2) moves the main blind in an X axis and a Y axis to control the size of the shot. A sub blind(51,52,53,54,55,56,57,58) selects a predetermined chip from the N chips in the shot formed by the main blind, and performs an exposure process regarding the pattern projected through the lens. A sub motor(X11-X18,Y11-Y18) moves the sub blind in an X axis and a Y axis to control the position of the main blind.
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