EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE BY USING THE SAME

摘要

PURPOSE: An epoxy resin composition for sealing a semiconductor is provided, which has a low alpha-ray emitting property and high thermal conductivity. And a semiconductor device by using the same is also provided. CONSTITUTION: The epoxy resin composition comprises: (i) 3-15 wt.% of an epoxy resin; (ii) 4-25 wt.% of a phenolic hardening agent; (iii) 70-95 wt.% of total inorganic filler wherein more than 50 wt.% of square shaped crystalline silica having an uranium concentration of not more than 1.5 part per billion and a thorium concentration of not more than 1.0 part per billion is used; and (iv) the balance of miscellaneous components. The semiconductor device is sealed by the epoxy resin composition.