| 摘要 |
PURPOSE: An epoxy resin composition of a semiconductor bag is provided, which has excellent forming property and bending property. And a semiconductor device using the same is also provided. CONSTITUTION: The epoxy resin composition of a semiconductor bag comprises: (i) 5-15 wt.% of an epoxy resin represented by the formula (1); (ii) 3-15 wt.% of a hardening agent which is one or a mixture compound selected from the group consisting of compounds represented by the formula (2) and compounds represented by the formula (3); (iii) 70-90 wt.% of an inorganic filler; (iv) 1.5-6 wt% of a flame retardant; and (v) other additives. In the formulae 1-3, n is an integer of 0-10.
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