WAFER CARRIER FOR CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A wafer carrier for a chemical mechanical polishing(CMP) apparatus is to obtain a uniform wide planarization by preventing an upper plate from being directly contacted with the carrier base. CONSTITUTION: The wafer carrier comprises a carrier base(23), an upper plate(24), an O-ring(26) and a gas layer(27). A groove is formed on an upper portion of the carrier base. A carrier pad(21) for holding the carrier base is formed on a lower portion of the carrier base. The carrier pad has the same diameter as the wafer. A wafer guide(22) formed on the carrier base holds a position of the wafer on an outer side of the carrier pad. The upper plate connected to a driving load is connected to an upper groove of the carrier base. A lower portion of the upper plate is formed evenly. The O-ring is installed on a lower outer circumference of the upper groove. The gas layer is formed between a lower portion of the upper groove and a lower portion of the upper plate.