发明名称 SEMICONDUCTOR CHIP WITH SURFACE COATING
摘要 A semiconductor chip having circuits which are produced in at least one layer of a semiconductor substrate and are arranged in at least one group. The semiconductor chip has at least one conductive protective layer which is arranged above at least one such circuit group and is electrically connected to at least one of the circuits. The substrate has at least one protective sensor, and the detection connection(s) of the protective sensor/protective sensors is/are connected to the conductive protective layer or to at least one of the conductive protective layers. Output connections of the protective sensor/protective sensors are connected to at least one of the circuits such that the circuit(s) cannot operate properly if there is a defined, nonvolatile level at the output of the protective sensor(s).
申请公布号 EP1114460(A1) 申请公布日期 2001.07.11
申请号 EP19990944441 申请日期 1999.08.18
申请人 INFINEON TECHNOLOGIES AG 发明人 SMOLA, MICHAEL;BRUECKLMEIER, ERIC-ROGER
分类号 G11C16/02;H01L21/822;H01L21/8247;H01L23/58;H01L27/04;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L23/58 主分类号 G11C16/02
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