发明名称 Thermally conductive silicone rubber composition
摘要 A thermally conductive silicone rubber composition, comprising (A) a curable organopolysiloxane (B) a curing agent; and (C) a filler prepared by treating the surface of a thermally conductive filler with an oligosiloxane having a formula selected from (i) (R<1>O)aSi(OSiR<2>3)(4-a) and (ii) (R<1>O)aR<2)<3-a)SiOÄR<2>2SiOÜnSi(OSiR<2>3)bR<2)<3-b) wherein R<1> is alkyl, each R<2> is independently a monovalent hydrocarbon group free of aliphatic unsaturation, subscript a is an integer from 1 to 3, b is an integer from 1 to 3, and n is an integer having a value greater than or equal to 0.
申请公布号 EP1101798(A3) 申请公布日期 2001.07.11
申请号 EP20000310126 申请日期 2000.11.15
申请人 DOW CORNING TORAY SILICONE CO., LTD. 发明人 ENAMI, HIROJI;ONISHI, MASAYUKI;OKAWA, TADASHI;ATNAKO, MASAAKI
分类号 C08L83/04;C08G77/04;C08K3/00;C08K5/5419;C08K5/56;C08K9/06;(IPC1-7):C08L83/04;C08L83/05;C08K3/22;C08K3/08;C08L83/07 主分类号 C08L83/04
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