发明名称 |
Thermally conductive silicone rubber composition |
摘要 |
A thermally conductive silicone rubber composition, comprising (A) a curable organopolysiloxane (B) a curing agent; and (C) a filler prepared by treating the surface of a thermally conductive filler with an oligosiloxane having a formula selected from (i) (R<1>O)aSi(OSiR<2>3)(4-a) and (ii) (R<1>O)aR<2)<3-a)SiOÄR<2>2SiOÜnSi(OSiR<2>3)bR<2)<3-b) wherein R<1> is alkyl, each R<2> is independently a monovalent hydrocarbon group free of aliphatic unsaturation, subscript a is an integer from 1 to 3, b is an integer from 1 to 3, and n is an integer having a value greater than or equal to 0. |
申请公布号 |
EP1101798(A3) |
申请公布日期 |
2001.07.11 |
申请号 |
EP20000310126 |
申请日期 |
2000.11.15 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
ENAMI, HIROJI;ONISHI, MASAYUKI;OKAWA, TADASHI;ATNAKO, MASAAKI |
分类号 |
C08L83/04;C08G77/04;C08K3/00;C08K5/5419;C08K5/56;C08K9/06;(IPC1-7):C08L83/04;C08L83/05;C08K3/22;C08K3/08;C08L83/07 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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