BURIED LOCAL INTERCONNECT

摘要

A method of fabricating a buried local interconnect in a substrate and an integrated circuit incorporating the same are provided. The method includes the steps forming a trench in the substrate and forming a first insulating layer in the trench. A conductor layer is formed on the first insulating layer. A portion of the conductor layer is removed to define a local interconnect layer and a second insulating layer is formed in the trench covering the local interconnect layer. The method provides for a local interconnect layer buried beneath a dielectric layer of an integrated circuit, such as a shallow trench isolation layer. Areas of a substrate above the silicon-silicon dioxide interface formerly reserved for local interconnect layers in conventional processing may now be used for additional conductor lines.